Carousel · 4:54 slidesNov 15, 2026

The AI Silicon Duel: Rubin vs. Instinct & TSMC's CoWoS Wall

NVIDIA's Vera Rubin and AMD's Instinct MI400 both bottleneck on one physical choke point: TSMC CoWoS-L interposer capacity.

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The AI Silicon Duel: Rubin vs. Instinct & TSMC's CoWoS Wall: Vera Rubin: NVIDIA's Post-Blackwell Rack Bet

All 4 slides

  1. The AI Silicon Duel: Rubin vs. Instinct & TSMC's CoWoS Wall, slide 1: Vera Rubin: NVIDIA's Post-Blackwell Rack Bet
    1. Vera Rubin: NVIDIA's Post-Blackwell Rack Bet
  2. The AI Silicon Duel: Rubin vs. Instinct & TSMC's CoWoS Wall, slide 2: Dr. Lisa Su's Counterpunch: AMD Instinct MI400
    2. Dr. Lisa Su's Counterpunch: AMD Instinct MI400
  3. The AI Silicon Duel: Rubin vs. Instinct & TSMC's CoWoS Wall, slide 3: Inside AMD's Open Ecosystem Play
    3. Inside AMD's Open Ecosystem Play
  4. The AI Silicon Duel: Rubin vs. Instinct & TSMC's CoWoS Wall, slide 4: The Real Choke Point: TSMC CoWoS-L Packaging
    4. The Real Choke Point: TSMC CoWoS-L Packaging

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